Posted by: xantham “This is the next generation of cooling devices,” Dr. Hongbin Ma tells PhysOrg.com. With a group of students at the University of Missouri-Columbia, and colleagues at Argonne National Laboratory and Intel Corporation, Ma presents the findings of a unique cooling device that makes use of an Oscillating Heat Pipe (OHP) and nanofluids. The findings, published online at Applied Physics Letters on April 5th, present a breakthrough that will provide a way for cooling technology to keep pace with developments in electronic technology.
“It is projected that the next generation of computer chips will produce localized heat flux over 10 MW/m2, with the total power exceeding 300 W. No existing low-cost cooling device can effectively manage the heat produced at this level,” asserts the Letter. The study will accelerate the development of next generation of cooling devices that incorporate nanofluids for ultrahigh-heat-flux electronic systems.
The results of the experiment show that when an oscillating heat pipe (OHP) is charged with a nanofluid, the ability of the OHP to transport heat increases. As this experiment illustrates, finding more efficient cooling for the next generation of computer chips, microchips, and electronic devices is under way. As society desires its gadgets to shrink ever smaller resulting in high power density, teams that work to develop the technology will find themselves in high demand.
“There are lots of applications that come from this experiment,” says Ma. “We really need to develop this further.”
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